Warning: file_put_contents(/www/wwwroot/ppbbu/www.30232.com/cache/f7128a31b070447fc5c6b6c6ceb0adf9.txt): failed to open stream: No space left on device in /www/wwwroot/ppbbu/www.30232.com/index.php on line 55 wafer dicing saw例句_wafer dicing saw英汉例句_wafer dicing saw双解例句_绍翊字体网有道词典
The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed. 从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；